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| EMIF06-HMC01F2 6-line IPADTM, EMI filter including ESD protection Features 6-line low-pass-filter High efficiency in EMI filtering Very low PCB space occupation: < 4.4 mm2 Lead-free package Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side) Flip Chip (16 bumps) 4 3 2 1 A B C D Complies with the following standards IEC 61000-4-2 level 4 on external pins - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 A1 A2 A3 A4 B1 B2 B3 B4 cmd clk Vmmc/Vdd MMCclk dat1 dat0 gnd MMCcmd C1 C2 C3 C4 D1 D2 D3 D4 Applications High speed MultiMediaCard Description The EMIF06-HMC01F2 is a highly integrated array designed to suppress EMI / RFI noise for high speed MultiMediaCard port filtering. The EMIF06-HMC01F2 Flip Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. dat2 gnd MMCdat1 MMCdat0 dat3 gnd MMCdat3 MMCdat2 Figure 2. Basic cell configuration R10 R11 R12 R13 R14 Vmmc MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3 Vmmc R2 R3 R4 R5 R6 R7 clk cmd dat0 dat1 dat2 dat3 GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/8 www.st.com 8 Characteristics EMIF06-HMC01F2 1 Characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter and test conditions Internal pins (A4, B4, C3, C4, D3, D4): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A1, A2, A3, B1, B2, C1, D1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value Unit VPP 2 2 15 8 125 -40 to +85 -55 to 150 kV Tj Top Tstg C C C Table 2. Symbol Electrical characteristics (Tamb = 25 C) Parameters I VBR IRM VRM Cline Symbol VBR IRM Cline Breakdown voltage Leakage current @ VRM VBR VRM IRM IRM VRM VBR V Stand-off voltage Input capacitance per line Test conditions IR = 1 mA VRM = 3V @ 0V 20 % 30 % 30 % Tolernace Min 14 Typ Max Unit V 0.1 20 50 75 7 A pF k k R2,R3,R4, I = 50 mA R5, R6, R7 R10, R11, R12, R13 R14 I = 50 A I = 200 A 2/8 EMIF06-HMC01F2 Characteristics Figure 3. 0.00 dB - 10.00 S21 (dB) attenuation measurement Figure 4. 0.00 dB - 10.00 Analog crosstalk measurement - 20.00 - 20.00 - 30.00 - 40.00 - 30.00 - 50.00 - 60.00 - 40.00 - 70.00 - 50.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G - 80.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G Figure 5. ESD response to IEC 61000-4-2 (+15kV air discharge) on one input (Vin) and on one output (Vout) Figure 6. ESD response to IEC 61000-4-2 (-15kV air discharge) on one input (Vin) and on one output (Vout) Input 10V/d Input 10V/d Output 10V/d Output 10V/d 200ns/d Figure 7. 200ns/d Junction capacitance versus reverse voltage applied (typical values) CLINE (pF) 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 Vosc=30mV F=1MHz Ta=25 C VLINE (V) 3/8 Application information EMIF06-HMC01F2 2 Application information Figure 8. Aplac model device structure R10 R11 Lbump Rbump Vmmc_Vdd Cbump Rsub A3 Lbump Rbump MMCclk Cbump Rsub A4 Lbump Rbump MMCcmd Cbump Rsub B4 Lbump Rbump MMCdat0 Cbump Rsub C4 Lbump Rbump Cbump Rsub C3 Lbump Rbump MMCdat2 Cbump Rsub D4 Lbump Rbump MMCdat3 Cbump Rsub D3 bulk Rgnd Cgnd bulk Lgnd bulk Rbump bulk dat3 Rbump Lbump Rsub Cbump D1 bulk bulk Lbump dat2 Rbump Lbump Rsub Cbump C1 bulk MMCdat1 MODEL = demif06_gnd bulk MMCdat2 R7 MMCdat3 MODEL = demif06 dat3 dat0 MODEL = demif06 bulk bulk dat1 Rbump Lbump Rsub Cbump B1 Rsub Cbump B2 bulk MMCdat0 R5 MMCdat1 R6 dat2 bulk Rbump Lbump dat1 MMCclk R3 MMCcmd R4 dat0 cmd Rsub Cbump A1 cmd bulk Rbump Lbump bulk Vmmc_Vdd R14 R2 clk clk Rbump Lbump Rsub Cbump A2 R12 R13 Figure 9. Aplac parameters Variables R2 50 R3 50 R4 50 R5 50 R6 50 R7 50 R10 75k R11 75k R12 75k R13 75k R14 7k Rsub 100m Variables Cz 11pF Cz_gnd 45pF RS_gnd 480m Ls 950pH Rs 150m Rbump 100m Lbump 50pH Cbump 0.15pF Lgnd 50pH Rgnd 100m Cgnd 0.15pF demif06_gnd BV=14 IBV=1m CJO=Cz_gnd M=0.31 RS=RS_gnd VJ=0.6 TT=100n demif06 BV=14 IBV=1m CJO=Cz M=0.31 RS=1 VJ=0.6 TT=100n 4/8 EMIF06-HMC01F2 Ordering information scheme 3 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m, bump = 315 m yy - xxx zz Fx 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 500 m 10 315 m 50 650 m 65 500 m 10 210 m 210 m 1.92 mm 50 m 1.92 mm 50 m 5/8 Ordering information EMIF06-HMC01F2 Figure 12. Footprint Copper pad Diamete : 250 m recommended, 300 m max Figure 13. Marking Dot, ST logo xx = marking z = manuafacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 315 m copper pad diameter xxz y ww Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 2.06 0.73 0.05 All dimensions in mm 8 0.3 STE STE STE xxx yww xxx yww xxx yww 4 0.1 User direction of unreeling 2.06 Note: More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 5 Ordering information Table 3. Ordering information Marking GH Package Flip Chip Weight 5.3 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF06-HMC01F2 6/8 EMIF06-HMC01F2 Revision history 6 Revision history Table 4. Date 25-Jan-2005 28-Apr-2008 Document revision history Revision 1 2 Initial release. Updated ECOPACK statement. Updated Figure 10, Figure 11, Figure 12, Figure 13 and Figure 14. Reformatted to current standards. Changes 7/8 EMIF06-HMC01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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